Flash / e.MMC

Flash / e.MMC

Embedded Multi-Media Memory Solution

Etron Technology has launched a series of e.MMC embedded, non-volatile memory devices to meet the needs of large-capacity storage and high-reliability applications, and is suitable for many consumer electronic devices (including smartphones, tablets and mobile network devices) ) common storage components.

e.MMC combines flash storage with controllers and interfaces into a single integrated package, providing a reliable and cost-effective solution for storing data and running applications. For developers, e.MMC simplifies interface design and qualification, thereby shortening time to market and accelerating support for future Flash device products.

 

The compact BGA packaging technology and low power consumption make e.MMC a low-cost memory solution suitable for mobile and embedded products. To better meet the needs of many space-constrained wearable devices and Internet of Things (IoT) applications, Etron launches the world's smallest e.MMC kit with a standard JEDEC footprint.

The technical specifications of e.MMC are defined and standardized by JEDEC, a global leader in developing open standards for the microelectronics industry. Etron Technology e.MMC supports JEDEC e.MMC5.1 function and is backward compatible with the old e.MMC standard, providing all the advantages of e.MMC.

 

Etron Technology also offers W-Temp e.MMC. The device's operating temperature range meets industrial operating temperature requirements (-40°C to +85°C), making it ideal for outdoor, surveillance, factory automation, transportation, and other fluid environmental conditions—the ideal storage solution for.

Features
  • Supports JEDEC e.MMC 5.1 and is compatible with old specifications to simplify the design process
  • High capacity 4GB ~ 128GB, providing customers with flexible choices
  • Standard temperature (-25°C~85°C) and wide temperature (-40°C~85°C), can be applied in different temperature ranges
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  • If grey-shaded in the table, indicates older generation products, NOT recommended for new designs
Density Part No Grade Speed Vdd Interface Package Datasheet
4GB(32Gb) EM74H08HVAGA-H Standard Temp. (-25~85C) 200MHz 3.3V JEDEC 153 ball FBGA (11.5x 13.0x0.8mm)
4GB(32Gb) EM74H08HVAGA-IH Wide Temp. (-40~85C) 200MHz 3.3V JEDEC 153 ball FBGA (11.5x 13.0x0.8mm)
8GB(64Gb) EM74I08HVAGA-H Standard Temp. (-25~85C) 200MHz 3.3V JEDEC 153 ball FBGA (11.5x 13.0x0.8mm)
8GB(64Gb) EM74I08HVAGA-IH Wide Temp. (-40~85C) 200MHz 3.3V JEDEC 153 ball FBGA (11.5x 13.0x0.8mm)
16GB(128Gb) EM74J08HVAGA-H Standard Temp. (-25~85C) 200MHz 3.3V JEDEC 153 ball FBGA (11.5x 13.0x0.9mm)
16GB(128Gb) EM74J08HVAGA-IH Wide Temp. (-40~85C) 200MHz 3.3V JEDEC 153 ball FBGA (11.5x 13.0x0.9mm)
32GB(256Gb) EM74K08LVAGA-H Standard Temp. (-25~85C) 200MHz 3.3V JEDEC 153 ball FBGA (11.5x 13.0x0.8mm)
64GB(512Gb) EM74L08LVAGA-H Standard Temp. (-25~85C) 200MHz 3.3V JEDEC 153 ball FBGA (11.5x 13.0x0.8mm)
64GB(512Gb) EM74L08LVAGA-IH Wide Temp. (-40~85C) 200MHz 3.3V JEDEC 153 ball FBGA (11.5x 13.0x0.8mm)
128GB(1024Gb) EM74M08LVAGA-H Standard Temp. (-25~85C) 200MHz 3.3V JEDEC 153 ball FBGA (11.5x 13.0x0.8mm)
128GB(1024Gb) EM74M08LVAGA-IH Wide Temp. (-40~85C) 200MHz 3.3V JEDEC 153 ball FBGA (11.5x 13.0x0.8mm)