Living KGDM Solution– The emergence of the theory and practice of “heterogeneous integration.” This concept means that instead of integrating logic, memory, analog, baseband, and high-voltage functions into a single SOC, different logic dies, memory dies, analog dies, baseband dies, and flash memory dies are integrated in 2.5D/3D layers to produce heterogeneous vertical integration.
High-quality Known Good Die solutions for System-in-Package (SIP) and Multi-Chip Package (MCP) needs, With the earliest development of KGDM technology and years of experience, Etron has been a valued partner to many of the world‘s leading semiconductor and systems customers. With a proven track record of high-volume manufacturing (HVM) capabilities, high-quality products, and a strong commitment to customer satisfaction, It makes Etron’s KGDM products stand out from many competitors.
Buffer DRAMs play an increasingly important role in electronic products. Application specific buffer memory KGD (known good die) offers 4C electronics with the benefits of reduced system costs and smaller physical volume, as well as meeting performance requirements in terms of low power consumption, high-speed data transfer, and minimized EMI (electromagnetic interference). In the age of the experience economy and application specific buffer memory, KGD enables significant increases in the performance of next generation electronics products. Particularly used in 2.5D/3D SIP applications, consumers are greeted with a completely new user experience.
|SDR SDRAM||16Mb ~ 256Mb|
|DDR SDRAM||16Mb ~ 512Mb|
|DDR2 SDRAM||128Mb ~ 1Gb|
|DDR3 SDRAM||512Mb ~ 4Gb|
|LPDDR4/LPDDR4x SDRAM||2Gb ~ 4Gb|