Etron@CES 2024: The Future of AI-Powered Intelligence, Connectivity, Autonomy & Confidentiality

Electronics brand is driving the future across four themes of cutting-edge technologies


Etron Technology, Inc. (TPEx: 5351), the world’s leading IC design company, is announcing its cutting-edge solutions that it will showcase at CES 2024 ‒ electronics with AI capabilities. With the parallel themes of Intelligence, Autonomy, Connectivity, and Confidentiality, the brand is demonstrating its relentless commitment to developing innovative products that enrich lives while advancing its vision of ‘Shaping Tomorrow Today’. To experience Etron’s demos and engage with in-house experts, visit CES Booth #15459, Central Hall at the LVCC, during January 9-12, CES 2024 period.


DeCloak Intelligences, an Etron Company, has been honored with the CES Innovation Awards for two consecutive years. This year’s recognition is attributed to its innovative privacy-centric facial recognition and monitoring solution – DeCloakVision. Positioned as a privacy-focused multimodal artificial intelligence-enhanced surveillance system, DeCloakVision complies with GDPR regulations, successfully striking a balance between protecting individual privacy and achieving targeted observation and tracking for specific activities. Designed to operate on both cloud and edge computing platforms, it offers flexibility and scalability to meet diverse monitoring needs. The system also employs decentralized AI models, utilizing differential privacy and quantum-safe homomorphic encryption technologies to achieve secure and anonymous tracking without compromising identity or public privacy. The award-winning product, DeCloakVision, will be live demonstrated at the Etron booth.


As a pioneer in 3D sensing, eYs3D Microelectronics, has evolved from focusing on 2D Image Signal Processing (ISP) to 3D Stereo Vision and 3D Sensing Solutions, historically serving numerous large clients in unmanned stores, VR equipment, and robotics with visual chips, 2D/3D sub-system solutions, and 3D Sensing Camera Module. In the coming CES, eYs3D will demonstrate “AI+” concept, integrating AI and other hardware and software accelerators into existing products, facilitating the realization of AI innovations. This includes expanding beyond the existing 2D/3D and stereo vision modules to include AI SoCs and other sub-system designs. Its product line is also extending from 130nm to 12nm, as it continues expanding to deliver more comprehensive solutions.


The preeminent E-Marker supplier globally, eEver (an Etron company) has successfully attained USB-IF Certification for USB4™ Version 2.0 and Intel Certification for Thunderbolt™ 5. The brand’s USB Type-C Cable ID Controller, the EJ903W, is designed to align with USB-IF’s latest USB4® v2.0 Specification, enabling top performance of 80 Gbps across four channels. This controller facilitates bi-directional data transmission over USB Type-C® cables and connectors. Furthermore, it is certified as a Thunderbolt™ 5 E-Marker IC, heralding the introduction of next-generation, high-performance electrical cables to the market.


Ushering in the era of inclusive application of IntelligenceN, Etron is actively advancing heterogeneous integration of products in product innovation. While stepping up efforts to engage in the development of innovative technologies and realize the mass production of advanced products, Etron sets high requirements for product quality and speeds up the development of high-performance, low-power DRAM products. Simultaneously, Etron has initiated heterogeneous integration of AI, logic IC, and DRAM, with plans to obtain patents worldwide as the company anticipates gaining from markets derived from innovative products. The company will showcase the RPC DRAM® Subsystem Total Solution, automotive memory solutions, and demonstrate the application of LRTDRAMTM in automotive and support for high-temperature environments in heterogeneous integrated packaging at CES’24.”

About DeCloak

DeCloak’s privacy computing solutions can be deployed through either software or hardware. With DeCloak’s patented corresponding AI prediction algorithm, all data processed can remain highly analyzable while preserving total privacy. The processed data is transmitted to the background or cloud in a de-identified format, and enterprises can use the AI ​​prediction model to run data analysis and architect big data trends.

About eYs3D Microelectronics

eYs3D Microelectronics a pioneer in 3D sensing technologies, and aims to develop semiconductor oriented technologies and products related to 3D vision-simulating computer vision technologies integrated with computer intelligence. With its strong foundation and experience in memory design and computer vision, as well as close co-operation with its parent company, Etron Technology, Inc., and ARM Holdings Plc., eYs3D strives to develop new technologies to take advantage of computer vision chips and subsystems. It targets blue-ocean markets such as smart products, intelligence of things (IoT), and industrial and consumer level automation, to become a leading brand in the market of computer vision processing. For more information, visit

About eEver Technology, Inc

eEver Technology, Inc. is a leading global USB Type-C solution design and product company, specializing in high speed transfer interface, power delivery, and audio/video streaming as core technologies, and in developing high performance USB-Type-C solutions. Its world-class track record of helping its clients succeed and develop USB Type-C system products enables systems providers to capitalize on this emerging and fast-growing market.

About Etron Technology, Inc.

Etron Technology, Inc. (TPEx: 5351. TW) is a world-class fabless and heterogeneous integration IC design company that specializes in the application-driven buffer memory, known-good die memory (KGDM), and long-retention time DRAM (RPC DRAM), and other artificial intelligence and machine learning-induced DRAM products. Etron also develops system-in-packages, including high-speed transfer interface chips of USB Type-C and 3D depth sensing computer vision and panoramic image capturing chips.


For further information, please contact:

Corporate Spokesperson: Ms. Justine Tsai

Corporate Deputy Spokesperson: Mr. Eason Cheng

Tel: +886-3-578-2345 #8670