Product News

2021/12/14

eYs3D Microelectronics brings Extended Reality (XR) Technologies Closer to Life and Health Care

FOR IMMEDIATE RELEASE

 

eYs3D Microelectronics brings Extended Reality (XR) Technologies Closer to Life and Health Care

Innovative Dual-Lens 3D Multi-Color Calibrative Image Process Chip Module- eSP777 Image Processing Controller IC’s Successfully Implemented in Medical-Grade Endoscopy Equipment Systems, Used in Spinal Microsurgery

Other Applications such as Smart Following Carts and Trolleys, Smart Fitness Mirrors, and other 3D Dual-Lens Visual Simulating Systems- Upcoming in the Near Future

 

Extended Reality (XR), also known as Augmented Reality (AR), is a generic term of contemporary visual technologies such as Visual Reality (VR) and Mixed Reality (MR), that aims to aid human lives through visual technologies. eYs3D Microelectronics has been involved in the XR industry early on since its formation, and has been a trusted chip provider and technical supporter for multiple world-class corporations that produce XR related hardware products. While most’s impression towards extended reality technologies still remains at purely entertainment-oriented applications, eYs3D has taken the uses and limits of this technology and pushed it far beyond games, incorporating XR technologies into the everyday things around us, as seen from eYs3D’s announcements titled “Life with 3D” during the CES 2022 event. Combining multiple industrial chains of its cooperating partners, eYs3D announces multiple products, prototypes, reference designs, and solutions related to medical and 3D computer vision fields, such as endoscopy equipment, smart-following trolleys, fitness mirrors, automated coffee-making arm machines, etc. eYs3D realizes the use of the once seemingly far-away and vague XR technologies, bringing our lives closer to us.

 

As automated, touchless, and interactive technologies slowly grow to become necessities due to heightening of global pandemics and the increasing demands of automated services, eYs3D’s image processing control IC platform- eSP777, provides its terminal products with high-resolution 3D point cloud meshes and 1080p depth maps, made possible through improved AI inference and image refining. Developed upon the endoscopy camera product used in spinal microsurgeries, eSP777 greatly increases the limits of resolution, perfecting 3D computer vision in medical fields.

 

eSP777 Dual Fish-Eye Lens 3D Multi-Color Image Warping-Calibration Process Chip platform is able to perform 180 degrees of de-warping and image calibration. Through data transfer of both wired and wireless options, the platform is able to remotely display the scanned item and environment, realizing a true 3D Genuine Hologram effect, making use for extended reality technologies of augmented reality uses, as well as 3D scenario replication. eSP777 also uses Etron’s self-developed Known-Good Die (KGD) buffery memory, guaranteeing product quality and keeping down product costs.

 

Due to the increasing demand of hardware and software platforms of computer-vision oriented artificial intelligence and machine learning technologies by developers, eYs3D displays multiple successful implementations of computer vision technologies into everyday use and applications, such as smart-following trolleys and carts, fitness mirrors, and automated coffee-making machine arms. Made possible by eSP876, a sensor chip that is able to actively output self-generated 3D depth maps, it is able to output 60 frames of 720 high-definition image scans per second. Paired with its excellent data compression capabilities, eSP777 is able to provide customized options of 3D images, as well as a unique XR experience.

 

eSP876 depth image control chip utilizes two horizontally parallel sensors and receivers. Through the output and processing of exported data, the chip is able to produce an image of various specifications, such as one with multiple viewing angles, wide field of view (FOV), and one of 3D details. Through appropriate image processing and analysis, the chip is able to generate even more specific details such as depth- in the form of color-coded depth maps. Such data can be used by system companies to develop extended reality and 3D image related applications, such as motion and gesture controlling technologies and products. eYs3D’s foundation in developing 3D image capture and applications, including its developed eSP876, paired with its excellence in vSLAM, reality technologies, gesture controls , and scenario detecting, is widely used in extended reality applications.

 

Be involved in Etron and eYS3D’s “Life with 3D’s” lifestyles. Experience technologies such as smart-following trolleys, fitness mirrors, automated coffee-making machine arms, and medical-grade endoscopic camera systems. Meet Etron at Booth No. 15595 at Central Hall, LVCC from Jan. 5th to Jan 8th of 2022, or catch our virtual demonstrations!

 

 

About eYs3D Microelectronics

eYs3D Microelectronics Corp. pioneers in 3D sensing technologies, and aims to develop semiconductor oriented technologies and products related to 3D vision-simulating computer vision technologies integrated with computer intelligence. With its strong foundations and experiences in memory design and computer vision, as well as close co-operations with its parent company- Etron Technology, Inc., and ARM Holdings Plc., eYs3D strives to develop new technologies and advantaging computer vision chips and subsystems, targeting blue-ocean markets such as smart products, intelligence of things (IoT), and industrial and consumer level automations, aiming to become a leading brand in the market of computer vision processing. www.eys3d.com

 

About Etron Technology, Inc.

Etron Technology, Inc. (TPEx: 5351.TW) is a world-class fabless and heterogeneous integration IC design company that specializes in application-driven buffer memory, known-good die memory (KGDM), long-retention time DRAM (RPC DRAM), and other artificial intelligence and machine learning induced DRAM products. Etron also develops system-in-packages, including high-speed transfer interface chips of USB Type-C, and 3D depth sensing computer vision and panoramic image capturing chips. www.etron.com

 

For further information, or to request a meeting at CES 2022 please contact:

 

Etron Technology America

Tel: +1-408-987-2255

Email: sales_america@etron.com

 

Corporate Spokesperson:

Ms. Justine Tsai

Corporate Deputy Spokesperson:

Mr. Eason Cheng

Tel: +886-3-578-2345 #8670

Email: pr@etron.com.tw