FOR IMMEDIATE RELEASE
[NEWS RELEASE]
<Computex ‘24>
Etron Technology’s MemorAiLink Platform : Revolutionizing Heterogeneous Integration in Semiconductor Development
Highlighting the EJ525D/EJ523D Audio-Visual Capture Application Subsystems, Now Entering Mass Production
Etron Technology, Inc. (TPEx: 5351.TW) continues to add successful examples to the MemorAiLink platform, providing integrated memory and memory controller support for logic chips in a one-stop development service. Etron Tech and eEver Tech have joined forces to develop the EJ525D/EJ523D audio and video capture ICs subsystems using the MemorAiLink platform. Multiple PCIe audio capture cards and video capture boxes from customer products have entered the mass production stage. This fully demonstrates the effectiveness of the MemorAiLink platform as a one-stop development service for heterogeneous integration, providing customers with more competitive solutions. Whether it’s innovative memory products, heterogeneous integration packaging, or memory interface IP services, all contribute to efficient development of innovative heterogeneous integration applications.
Following the launch earlier this year of the new AI SoCs platform – MemorAiLink (AI+DRAM heterogeneous integration platform), the RPC Subsystem Total Solution has been introduced. It helps in minimizing extremely small and low-power special application ASIC system designs, effectively reducing pin counts and complexity, as well as saving the cost of package spacers. This further optimizes the overall heterogeneous integration packaging solution and has gained significant market favor.
Dr. Nicky Lu, Chairman of Etron Tech, stated that ”heterogeneous integration and chip subsystem design are the primary trends in future semiconductors. Etron Technology’s “MemorAiLink” AI memory platform enables the integration of technical components from different customer applications with the most suitable memory and packaging technologies, achieving highly complex chip designs and shortening time to market for products. The launch of innovative heterogeneous integration chip products EJ525D/EJ523D using the MemorAiLink platform is particularly significant for developing subsystems for audio and video capture ICs. Considering the many emerging opportunities brought by audio and video streaming technology applications, the introduction of the EJ525D/EJ523D audio signal processors and customer products using the MemorAiLink platform has entered mass production. This provides more possibilities for multiple signal switching and integration, as well as audio and video streaming applications and business models.”
The RPC Subsystem Total Solution combines Etron’s independently developed RPC DRAM®, RPC controller, and eYs3D’s 3D depth image chip. It can assist in minimizing extremely small and low-power special application ASIC system designs, providing a complete AI terminal application solution to accelerate the popularization of terminal artificial intelligence applications. By adopting x16 DDR3 LPDDR3 data bandwidth and achieving the industry’s smallest volume and lowest cost FI-WLCSP packaging, it effectively reduces wire counts and complexity compared to using traditional DDR3 in packaging, saving the cost of package spacers and further optimizing the overall heterogeneous integration packaging solution.
“Etron’s core technology lies in memory and logic chip design. In recent years, they have been continuously developing various innovative memory solutions, such as the one-stop development platform “MemorAiLink” that integrates memory and memory controller support for logic chips. Through innovative memory products, heterogeneous integration packaging, and memory interface IP services, they aim to provide customers with more competitive solutions,” said Dr. Nicky Lu.
About eYs3D Microelectronics
eYs3D Microelectronics Corp.is a pioneer in 3D sensing technologies, and aims to develop semiconductor oriented technologies and products related to 3D vision-simulating computer vision technologies integrated with computer intelligence. With its strong foundation and experience in memory design and computer vision, as well as close co-operation with its parent company, Etron Technology, Inc., and ARM Holdings Plc., eYs3D strives to develop new technologies to take advantage of computer vision chips and subsystems. It targets blue-ocean markets such as smart products, intelligence of things (IoT), and industrial and consumer level automation, to become a leading brand in the market of computer vision processing. For more information, visit www.eys3d.com
About eEver Technology, Inc
eEver Technology, Inc. is a leading global USB Type-C solution design and product company, specializing in high speed transfer interface, power delivery, and audio/video streaming as core technologies, and in developing high performance USB-Type-C solutions. Its world-class track record of helping its clients succeed and develop USB Type-C system products enables systems providers to capitalize on this emerging and fast-growing market. www.eevertech.com
About Etron Technology, Inc
Etron Technology, Inc. (TPEx: 5351. TW) is a world-class fabless and heterogeneous integration IC design company that specializes in the application-driven buffer memory, known-good die memory (KGDM), innovative RPC DRAM®, KOOLDRAMâ (Long Retention Time DRAM，LRTDRAMTM), and other artificial intelligence and machine learning-induced DRAM products. It also features high-speed transfer interface chips for USB Type-C, Machine Vision Sensing Cameras, Modules, and ICs, along with a Depthmap Processing Unit. These offerings can be integrated to fulfill customer requirements for AI applications. To learn more, please visit www.etron.com
For further information, please contact:
Corporate Spokesperson:
Ms. Justine Tsai
Corporate Deputy Spokesperson:
Mr. Eason Cheng
Tel: +886-3-578-2345 #8670
Email: pr@etron.com.tw