2019/05/20

Etron Technology will Jointly Exhibit at IDB’s AI Life Pavilion and Give a Talk on “Sensor Fusion to Accelerate AIoT Ecosystem”

FOR IMMEDIATE RELEASE[NEWS RELEASE]<2019 Computex AI-Life Pavilion and InnoVEX Forum> Etron Technology will Jointly Exhibit at IDB’s AI Life Pavilion and Give a Talk on “Sensor Fusion to Accelerate AIoT Ecosystem”In order to elaborate the future AI Life styles’ the Industrial Development Bureau of the Ministry of Economic Affairs organizes a Pavilion for Artificial Intelligence Applications. It aims at integrating and enriching the capability of various AI vendors through the joint exhibits’ thus drive the overall business opportunities. Etron Technology (TPEx: 5351.TW) along with its subsidiaries eYs3D have been offering the latest Natural Light 3D depthmap sensing camera fused with IMU’ Audio as well as high speed data transmission technologies that been adopted by world leading AR/VR companies. Come and Meet Etron Team at Booth No. L1018’ IDB’AI Life Pavilion’ Nangang Exhibition Hall 1 during Computex 2019 (May28 – Jun 1) that learn more about how to accelerate your next generation AIoT Ecosystem utilizing the sensor fusion solutions. eYs3D partners with several US software/hardware AI technology providers such as Augmented Pixels and Kneron to launch “Sensor Fusion to Accelerate AIoT Ecosystem” at InnoVEX’s AI Trend and Applications Forum. Just like a human who has 5 senses e.g. Sight (eyes)’ Hearing (ears)’ Taste (mouth)’ Smell (nose) and Touch (hands)’ the Artificial Intelligent (AI) also need multiple sensing capabilities to process on. From our AR/VR customers productions & roadmaps’ we felt the urgent need for sensor fusion by integrating more and more color cameras with 3D depth sensing (the Eyes)’ Microphones & IMU (the Ears & Inner Ear)’ Speakers (the Mouth)’ Gesture/Finger Control (the Hand movements) … etc. As we are fast moving toward the Artificial Intelligent of Thing (AIoT) & Machin Learning (ML) enabled world’ we require a better quality Audio/Video sensors’ and capturing & sensing devices to create BIG DATA for such processing need. Artificial Intelligence has created a new technology wave! The 3D sensing technology is essential to computer vision’ so as an indispensable part of the AI and one of the key parts to the implementation of AIOT solutions. In this regard’ Etron Tech will demonstrated (1) The new Head-Mounted Display (HMD) with 3D Vision Processor IC Embedded’ (2) 360° FHD 3D depthmap camera – EX8040 sub-system’ (3) 3D face detection for artificial intelligence applications. Thanks for the hardware partners’ Etron will be sharing demos like: Crossbar’s AI-ReRAM chip’ Gyrfalcon’s AI Accelerator’ Kneron’s Edge AI Solutions’ and Augmented Pixels’ vi-SLAM software which utilizing the sensor fusion solutions provided by eYs3D.About eYs3D Microelectronics’ Corp.eYs3D Microelectronics’ Corporation is a world leading provider of the 3D depth-sensing solutions provider focusing on innovative natural light 3D depthmap and 360o spherical camera processors & systems. www.eys3d.comAbout Etron TechnologyEtron Technology’ Incorporated (TPEx: 5351.TW) is a world-class fabless IC and Heterogeneous Integration (HI) Silicon design house with products ranging from Consumer Electronics DRAM (CEDRAM)’ Known-Good-Die Memory (KGDM)’ RPCTM (Reduced-Pin-Count) DRAM; USB3.1 Gen2 Type-C high speed switch/mux controller with Power Delivery; and 3D Depthmap and Stereoscopic Vision Sensing & Spherical Image-Processing ICs and Subsystems. www.etron.comFor further information’ please contact:Corporate Spokesperson:Ms. Justine Tsai Corporate Deputy Spokesperson:Mr. Eason ChengTel: +886-3-578-2345 #8670Email: pr@etron.com.tw