The new wave of Artificial intelligence has swept the whole world! 3D depth sensing has been treated as the “eyes” of AI technology, giving devices the perceptual-visual/auditory abilities to understand the environments & surroundings which is an indispensable part of AI, and the key for its deeper learning and feature enhancement. eYs3D Microelectronics and Etron Technology (TPEx:5351.TW) jointly launched the new 3D Depth platform EX8040/EX8040S cameras; the new ultra-wide-angle 4K + 3D depth image sensing module, greatly enhanced AI / 3D sensing capability of distance measurement, speed detection and point cloud generation for ML systems. The system integrators and device manufacturers can directly benefit from the reduction of extra equipment, lower maintenance cost and to achieve higher efficiency by adopting these new camera solutions to accelerate their time-to-market.
360° 3D Panorama Depthmap + IMU + Mic Sensor Fusion Camera — EX8040This brand new 3D Panorama Depth Map Camera is a 360-degree panoramic view with two sets of EX8040S cameras stacked back-to-back each with ultra-wide-angle 180 degrees, 1080p Full-HD resolution depth map, 4K ultra-high definition color image, and optional two-channel audio microphones processing. In addition, a patterned infrared projector (IR Dot Projector) and a 6-DoF IMU inertial sensing also added to this multi-aperture depth measurement & acquisition subsystem, using an in-house eSP877 depthmap processor chipset, combined with one 13Mp color image sensor and a pair of stereoscopic 3.3Mp image sensors seamlessly blends together to provide 1920x1080p high resolution Color + Depthmap data at 24 frames per second. The camera works under both bright daylight and dark nights for capturing both horizontal and vertical surroundings. All the depthmap data, 4K color image, and IMU information are fully synchronized thanks to its “inter-camera & intra-camera time stamp” capability which can instantly and directly capture 360-degree spatial view information. The camera also equipped with super-high-speed USB 3.1 Gen2 10Gbps channel to communicate with the back-end AI processors. EX8040 sensor fusion camera is the best solutions for visual-inertial-SLAM (vi-SLAM) and device positioning along with AI machine/deep learning and neural network recognition operations.
180o 1080p 3D Depthmap + IMU +Mic Sensor Fusion Camera – EX8040SThe EX8040S is equipped with a 180-degree ultra-wide viewing angle, 1080p high-resolution depth map, 4K ultra-high-definition color resolution and a 6-DoF IMU inertial sensing with optional microphone inputs. This triple-aperture depthmap sensor fusion camera sub-system has received the “Best Choice Award” (BC Award) from Computex Taipei 2019.
Defining the Future of AI Visions – eYs3D Enhances Robot and AI with 3D Eye SenseFrom integrated chip and module design to handle advanced image and algorithm processing, eYs3D combines the best cost-effective optics and production-proven knowhow to create the most advanced 3D depth sensing fusion systems. The color bionic 3D point cloud software integration makes it the best “Technology Eyes” in the industry regardless of the ambient lighting conditions. It is the best solution that combines machine vision & cognition for AI/ML applications.
During the Computex19’ tradeshow in Taipei Nangang, Etron & eYs3D will be presenting a live demonstration of their “EX8040 – 360o Dual 4K Color + Dual 3D 1080p Depthmap + IMU” & “EX8040S” – 180o 4K Color + 3D 1080P Depthmap +IMU” cameras’ capabilities. The user can experience first-hand the ultra-wide angle of 4K + 3D depth sensing which will drastically enhance the AI/ML ability to detect and recognize objects anywhere anytime. Please come and talk to our in-house experts and experience the new technologies in our Booth No. S0410, Taipei Nangang Exhibition Hall 2, 4F.
About eYs3D Microelectronics, Corp.eYs3D Microelectronics, Corporation is a world leading provider of the 3D depth-sensing solutions provider focusing on innovative natural light 3D depthmap and 360o spherical camera processors & systems. www.eys3d.com
About Etron TechnologyEtron Technology, Incorporated (TPEx: 5351.TW) is a world-class fabless IC and Heterogeneous Integration (HI) Silicon design house with products ranging from Consumer Electronics DRAM (CEDRAM), Known-Good-Die Memory (KGDM), RPCTM (Reduced-Pin-Count) DRAM; USB3.1 Gen2 Type-C high speed switch/mux controller with Power Delivery; and 3D Depthmap and Stereoscopic Vision Sensing & Spherical Image-Processing ICs and Subsystems. www.etron.com
For further information, please contact:Corporate Spokesperson:Ms. Justine Tsai Corporate Deputy Spokesperson:Mr. Eason ChengTel: +886-3-578-2345 #8670Email: email@example.com