FOR IMMEDIATE RELEASE
Etron Technology presents “3D Imaging: Capabilities, Approaches and Future Applications” Talk and Demonstration at Image Sensors Americas 2014 in San Francisco, California
Advanced gesture recognition and sensing technology is coming to Image Sensors Americas 2014. Etron Technology, Inc. (Taiwan GTSM: 5351), renowned for its innovative IC products and R&D capability, will present a talk entitled “3D Imaging: Capabilities, Approaches and Future Applications” at the Image Sensors Americas conference at Hyatt Fisherman’s Wharf in San Francisco, California on September 10-11, 2014. The talk is scheduled to be presented at 11:30 am on September 11 by Richard Crisp, Vice President of World Wide Marketing and Product Development.
Etron Technology also will be demonstrating its revolutionary eSP870 3D Depth Map Stereoscopic Camera controller in its exhibition space at the conference. The demonstrations will show the benefits of using Etron’s hardware-based depth-map IC for manufacturing low-cost stereoscopic 3D cameras that meet the cost targets appropriate for high-volume cost-sensitive consumer products such as 3D scanners and gesture recognition systems.
Because the eSP870 incorporates an on-chip hardware depth-map engine, significant processing workload is off-loaded from the CPU / SOC improving the user experience versus software-based approaches. The high level of system integration in the eSP870 simplifies and miniaturizes the stereo camera module design while featuring a minimum BOM cost. With off the shelf availability and a simplified module design the eSP870 is the low-risk path to market for high volume consumer products incorporating high-performance 3D imaging technology at low cost.
For further information, please contact:
Ms. Justine Tsai
Tel: +886-578-2345 ext. 8669
Email: pr@etron.com.tw