RPC DRAM: Achieving Automotive Grade2 AEC-Q100 Certification and Entering Global Automotive Supply Chain.
MemorAiLink Memory IP Platform: Enhancing Memory Bandwidth Performance, Subsystem Computational Power Efficiency, and Heterogeneous Integration Packaging Technology, Enabling the Expansion of Generative AI into Edge Applications.
Etron Memory: High Quality and Reliability Have Positioned Etron as a Long-Term Stable Supplier of Memory products, Supporting the Gradual Deployment of AI Edge Applications.
As generative AI shifts from the cloud to the edge, the demand for memory in edge devices is rapidly increasing. Etron Technology (TPEx: 5351) is actively advancing AI edge applications and heterogeneous integration, laying a foundation for the miniaturization of AI/ML microsystems globally. Etron’s RPC DRAM®, utilizing WLCSP (Wafer-Level Chip Scale Packaging) technology, has achieved the automotive Grade-2 AEC-Q100 certification and entered the supply chain of leading international car brands.
For generative AI edge applications, RPC DRAM offers a significant reduction of over half the pin count compared to traditional DDR3 products, and only required 1/10 the PCB area, making it the optimal solution to address size, cost, and power consumption challenges, achieving notable success in collaborations with customers in the AI-Edge, Wearable, and FPGA domains.
Etron Technology actively utilizes its integrated memory and memory interface IP to support the one-stop development for logic chips – MemorAiLink. This platform drives advancements in memory bandwidth performance, subsystem computing power efficiency, and heterogeneous integration packaging technology. It not only provides high-bandwidth, customized memory solutions to meet the demands of AI high-speed computing and large data processing. Through one-stop memory interface IP services, it can simultaneously reduce the power consumption for both logic chips and memory while ensuring seamless communication between the two ends to shorten development timelines. Additionally, MemorAiLink provides cost-optimized heterogeneous integration packaging plans tailored to customer application scenarios, effectively addressing challenges in chip design. By leveraging diverse high-bandwidth memory, streamlined IP services, and advanced heterogeneous integration, the platform delivers comprehensive and efficient subsystem solutions. These solutions achieve faster data processing speeds, lower power consumption, and seamless integration with next-generation edge AI systems, offering exceptional performance and cost advantages.
High quality and high reliability have earned Etron Technology high recognition from customers, making it a long-term partner for DRAM products. With over 33 years of deep cultivation in the global memory market, Etron adheres to its commitment to stable supply and long-term support, continuously expanding its product line to offer customers a diverse range of choices. The current product portfolio includes SDR, DDR, DDR2, DDR3, DDR4, LPDDR2, LPDDR4/4X SDRAM, as well as innovative RPC DRAM, SPI NAND, and e.MMC. In terms of DRAM, the range of I/O bits spans from 4 to 64 bits, and capacities range from 16Mb to 32Gb, meeting the needs of various application scenarios. Some AI edge applications, including smart door locks, panoramic cameras, Blu-ray DVD players, smart speakers, and robotic vacuum cleaners, have been successful implementation and fueled innovation.
With the rapid advancement of AI, Edge AI applications are becoming mainstream, posing unprecedented challenges for IC design companies in ASIC development and neural network system integration. “Etron Tech’s MemorAiLink platform is the solution born to address these challenges,” said Dr. Nicky Lu, Etron Tech Chairman & CEO. “As we move towards the AI subsystem era, Etron’s MemorAiLink platform enhances memory bandwidth performance, reduces subsystem computing power consumption, and optimizes heterogeneous integration packaging technology. By supporting one-stop development for logic chips, it has become a crucial partner for ASIC and neural network system developers.”
For the development of emerging AI systems, Etron’s IC design team continues to focus on specialty DRAM design and full-chip solutions for microsystems. Chairman Nicky Lu reflected on Etron Technology’s extensive experience in memory IC design, stating, “Etron Technology has been steadfast in self-developing Memory ICs for over 33 years. In the 1990s, we introduced Taiwan’s first 16Mb DRAM, 4Mb SRAM, and advanced EDA tools for efficient logic design methodologies, which spurred the growth of numerous design companies. From 1995 to 1997, Etron shipped the world’s fastest graphics DRAMs to leading 3D graphics companies, including NVIDIA, Toshiba. In 2000, we launched KGDM (Known-Good-Die Memory) bare die products, supplying Tier-1 customers like Intel, Seagate, and MediaTek, and pioneering global semiconductor heterogeneous integration. In 2010, our KGD DRAM chips were integrated into Seagate products and used in Apple’s first-generation iPod. By 2015, we collaborated with Intel to develop Wide-IO DRAM KGD for 3D microsystems. In 2020, we introduced RPC DRAM, the world’s smallest chip-scale packaged DRAM with drastically reduced pin counts, used in automotive infrared camera sensors. Combining these experiences, we launched MemorAiLink in 2023 ‒ an AI one-stop development platform, establishing a leading DRAM IP design service. These achievements demonstrate Etron’s ongoing dedication to innovation and its pioneering role in the semiconductor industry.”
In addition to actively investing in the development and promotion of innovative platforms, Etron also continues to strengthen its position as a key supplier in the telecommunications broadband network field. According to Digitimes, the global Wi-Fi market is currently dominated by Wi-Fi 6/6E, and it is expected that the penetration rate of Wi-Fi 7 will exceed double digits by 2025. Etron’s comprehensive DRAM and Flash solutions fully meet customer demands across Wi-Fi generations, from Wi-Fi 5 and Wi-Fi 6/6E to the upcoming Wi-Fi 7 era. Furthermore, Etron has been listed as a qualified supplier by several major international Wi-Fi chip manufacturers, including Qualcomm, Broadcom, MediaTek, and Realtek.
The global semiconductor market is evolving rapidly, with technological innovations and application demands changing at an unprecedented pace. Etron Tech remains committed to being customer-focused, continuously advancing its technologies, and optimizing its products and services. Looking ahead, Etron will further deepen its technological strategies in AI, networking, and diverse application scenarios. Leveraging its extensive R&D expertise and market insights, the company aims to collaborate closely with its customers to create greater value for the industry.
CES is a globally influential technology event, and Etron Technology Group focuses on the theme of “Innovation in Action, AI Implementation, and Connecting MemorAiLink to Shape the Future.” Etron Technology Group demonstrates its commitment to developing innovative products with IC solutions that embody “Pervasive Intelligence” and “Heterogeneous Integration.” These products empower electronic devices with AI capabilities such as cognition, vision, neural networks, and privacy, enriching AI applications while advancing the vision of future living. Etron Technology Group’s booth (Booth Number: 15741, Central Hall, LVCC) is open for visits and collaboration, aiming for a win-win partnership!
About Etron Technology, Inc
Etron Technology, Inc. (TPEx: 5351. TW) is a world-class fabless and heterogeneous integration IC design company that specializes in the application-driven buffer memory, known-good die memory (KGDM), innovative RPC DRAM® and other artificial intelligence and machine learning-induced DRAM products. It also features high-speed transfer interface chips for USB Type-C, Machine Vision Sensing Cameras, Modules, and ICs, along with a Depthmap Processing Unit. These offerings can be integrated to fulfill customer requirements for AI applications. To learn more, please visit www.etron.com
For further information, please contact:
Corporate Spokesperson:
Ms. Justine Tsai
Corporate Deputy Spokesperson:
Mr. Eason Cheng
Tel: +886-3-578-2345 #8670
Email: [email protected]