The AI wave is driving unprecedented demand for high bandwidth, low power consumption, and customized heterogeneous memory integration. In response to this pivotal industry shift, Etron Technology (TPEx: 5351) is rapidly expanding the technological scope of its one-stop AI memory development platform, MemorAiLink®, strengthening end-to-end services that span custom memory solutions, AI-optimized memory, and heterogeneous integration packaging.
At CES 2026, Etron will showcase multiple solutions developed through MemorAiLink®, including the award-winning RPC inside G120 Subsystem, newly upgraded and scalable DDR3 products, and an upcoming ASIC AI memory solution designed to support edge AI computing for SLMs (Small Language Models) and VLMs (Vision-Language Models). These offerings demonstrate Etron’s comprehensive and strategic commitment to the global AI market.
Award-Winning RPC inside G120 Subsystem: Redefining 3D Vision Sensing
Recognized with the 2025 Hsinchu Science Park Innovative Product Award, the RPC inside G120 Subsystem leverages System-in-Package (SiP) technology to heterogeneously integrate Etron’s self-developed RPC DRAM®, RPC controller, and 3D depth imaging IC (Depth Map Chip) from Etron’s subsidiary, eYs3D Microelectronics. This integration delivers a next-generation 3D vision depth-sensing solution.
Compared with conventional DDR3 memory solutions, RPC DRAM® reduces pin count by more than 50% and PCB footprint by over 90%, significantly simplifying routing and packaging while lowering overall system cost. It provides an optimized memory solution tailored to the stringent requirements of compact form factors and ultra-low-power devices.
Scalable DDR3 Portfolio to Meet Growing Customization Needs
As demand for diversified and customized memory solutions continues to surge, Etron has introduced a newly upgraded DDR3 product line designed with scalability at its core. Capacity can be flexibly expanded from 2Gb to 4Gb and 8Gb, while bandwidth configurations scale from x16 to x32.
These new DDR3 products are already being planned and co-developed with leading SoC customers across consumer applications, including networking equipment and set-top boxes, accelerating the adoption of next-generation, high-performance devices.
ASIC AI Memory for Edge AI SLMs and VLMs
To address the rapid growth of edge AI computing based on SLMs and VLMs, Etron will soon introduce a dedicated ASIC AI memory solution that integrates a complete DRAM + PHY + Controller architecture.
This ASIC AI memory solution offers cost-effective packaging, ultra-compact design, and flexible capacities ranging from 8Gb to 32Gb, selectable based on AI model size. It delivers bandwidth of up to 204.8 GB/s, enabling output performance of approximately 50 tokens per second for SLMs or VLMs with up to 8 billion parameters, meeting the stringent requirements of on-device AI and real-time inference.
Strengthening DDR4 and LPDDR4/4X for Long-Term Supply Stability
As major global DRAM suppliers increasingly shift resources toward HBM and advanced process nodes, Etron is simultaneously strengthening its DDR4 and LPDDR4/4X product lines. Its 4Gb–16Gb DDR4 and 2Gb–32Gb LPDDR4/4X solutions are widely deployed across a broad range of applications, including:
In parallel, Etron has established strategic alliances across its supply chain, reinforcing long-term partnerships to ensure stable supply and sustained product support for customers worldwide.
Three Decades of Memory Expertise, Driving the Future of AI
With more than 30 years of experience in the global memory market, Etron remains firmly customer-centric, continuously expanding both the breadth and depth of its product portfolio. The company now offers comprehensive coverage across SDR, DDR, DDR2, DDR3, DDR4, LPDDR2, LPDDR4/4X SDRAM, the innovative RPC DRAM®, as well as SPI NAND and e.MMC, while continuing to invest in next-generation memory technologies.
Looking ahead, Etron will continue to drive the evolution of AI memory through innovation, working closely with global customers to build a more efficient, intelligent, and competitive AI ecosystem.
Etron Technology Group at CES 2026
Under the central theme “MemorAiLink® Show Up,” the Etron Technology Group will make a strong presence at CES 2026, focusing on four key pillars: memory, intelligent vision sensing, high-speed interconnects, and privacy-preserving computing. The showcased innovations and edge AI solutions are designed to enhance system performance, reduce design complexity, and accelerate the deployment of intelligent and automated applications, collectively advancing the vision of future smart living.
We cordially invite our industry partners and visitors to join us at the Etron Technology Group booth (Booth No. 14841, Central Hall, LVCC). Let’s connect, collaborate, and create mutual success together.
Caption: Etron Technology Group showcases its innovations at CES 2026 under the theme “MemorAiLink® Show Up.”
About Etron Technology, Inc
Etron Technology, Inc. (TPEx: 5351. TW) is a world-class fabless and heterogeneous integration IC design company that specializes in the application-driven buffer memory, known-good die memory (KGDM), innovative RPC DRAM® and other artificial intelligence and machine learning-induced DRAM products. It also features high-speed transfer interface chips for USB Type-C, Machine Vision Sensing Cameras, Modules, and ICs, along with a Depthmap Processing Unit. These offerings can be integrated to fulfill customer requirements for AI applications. To learn more, please visit www.etron.com
For further information, please contact:
Corporate Spokesperson:
Ms. Justine Tsai
Corporate Deputy Spokesperson:
Mr. Eason Cheng
Tel: +886-3-578-2345 #8670
Email: [email protected]