FOR IMMEDIATE RELEASE
[NEWS RELEASE]
[Computex 2024]
eYs3D Microelectronics Unveils the Multi-Camera Sensing System – SenseLink, Providing a Versatile Machine Vision Sensing Solution for Smart Applications
eYs3D Microelectronics, with years of expertise in the fields of 3D sensing and computer vision, is a subsidiary of Etron Tech (TPEx: 5351). It has recently launched SenseLink, a multi-camera sensing system chip designed to enhance visual AI sensing capabilities. This technology utilizes advanced sensor fusion techniques to integrate data from multiple sensors, greatly enhancing AI computing capabilities and providing powerful visual sensing solutions for smart applications.
The SenseLink multi-camera sensing system from eYs3D has the capability to receive signals from multiple cameras. Equipped with eCV5546 and eSP930, it can simultaneously connect to up to 7 cameras, providing flexible options for camera configuration with adjustable multi-directionality and angles, meeting the diverse needs of different application scenarios. With three built-in sets of performance image signal processors (ISPs), including two color ISPs and one black and white ISP, it can achieve image processing with different resolutions and color specifications within a single system, enhancing the diversity and flexibility of image processing. Furthermore, it supports rich META-DATA, facilitating the transmission of various consistent information through independent digital channels, including automatic exposure data, optical flow, special timestamps, and other data from heterogeneous sensor settings, improving the accuracy of data processing and analysis. With the rapid development of AI, SenseLink is expected to demonstrate its outstanding performance in fields such as smart homes, industrial automation, and medical assistance, creating convenient and user-friendly experiences for users.
In the field of machine vision applications in AI development, eYs3D’s SenseLink possesses several advantages. Firstly, in high-speed multi-camera applications, it can capture multiple images within milliseconds, instantly capturing changes in objects or scenes. It provides high sensitivity to motion, micro-motions, and deformations, suitable for robot vision scenarios requiring high sensitivity. Secondly, it features a multi-focal heterogeneous camera array, allowing different lenses to capture images with varying depths of field, covering image capture at different distances; it provides clear visual effects from short to long distances, suitable for optical inspection (AOI) and industrial automation. Additionally, in wide-area object tracking camera applications, multiple camera arrays are oriented in different directions, achieving a close to 360-degree high-definition panoramic view using multiple cameras. This allows for object tracking within a wide field of view without the need for moving mechanical parts, thus preventing the loss of targets. When combined with AI object detection technology, it can more accurately identify specific objects.
With its powerful multi-camera access and image processing capabilities, eYs3D’s SenseLink is poised to become a key tool in enhancing visual AI sensing performance. This innovative technology not only provides advanced visual solutions for various application scenarios but also paves the way for future smart applications. eYs3D will continue to dedicate itself to technological innovation, driving the development of AI technology and bringing to the market more intelligent and efficient solutions.
Welcome to visit Etron Technology Group’s booth at COMPUTEX 2024, where you can experience the most advanced AI electronic solutions. As a pioneer of continuous innovation, Etron realizes IC system products through intelligence, autonomy, connectivity, and privacy, mimicking the functions of the human brain, eyes, and nerves while ensuring privacy. We are dedicated to enriching life and invite you to explore the future of AI together! Visit us from June 4-7, 2024, at Taipei Nangang Exhibition Center, Hall 2, 4F R0908, and USB-IF at Hall 1, 4F N0607a. www.etron.com
About eYs3D Microelectronics
eYs3D Microelectronics Corp.is a pioneer in 3D sensing technologies, and aims to develop semiconductor oriented technologies and products related to 3D vision-simulating computer vision technologies integrated with computer intelligence. With its strong foundation and experience in memory design and computer vision, as well as close co-operation with its parent company, Etron Technology, Inc., and ARM Holdings Plc., eYs3D strives to develop new technologies to take advantage of computer vision chips and subsystems. It targets blue-ocean markets such as smart products, intelligence of things (IoT), and industrial and consumer level automation, to become a leading brand in the market of computer vision processing. For more information, visit www.eys3d.com
About Etron Technology, Inc.
Etron Technology, Inc. (TPEx: 5351.TW) is a world-class fabless and heterogeneous integration IC design company that specializes in application-driven buffer memory, known-good die memory (KGDM), long-retention time DRAM (RPC DRAM), and other artificial intelligence and machine learning induced DRAM products. Etron also develops system-in-packages, including high-speed transfer interface chips of USB Type-C, and 3D depth sensing computer vision and panoramic image capturing chips. www.etron.com
For further information, please contact:
Corporate Spokesperson:
Ms. Justine Tsai
Corporate Deputy Spokesperson:
Mr. Eason Cheng
Tel: +886-3-578-2345 #8670
Email: pr@etron.com.tw