With the rapid development of modern technology, the demand for intelligent binocular vision cameras continues to increase. eYs3D Microelectronics is set to introduce a series of Intelligent Dual-lens Sub-systems with IPX3 and IP67 ratings. This camera series is suitable for outdoor and harsh environment applications, including transport robots and smart agricultural machines.
eYs3D Microelectronics’ Intelligent Dual-lens Sub-systems can be paired with our upcoming advanced process chip, combining cutting-edge technology for outstanding performance and durability, making it suitable for applications that require operation in harsh environments. With its IPX3-rated protection, the camera module can effectively resist the ingress of sprayed water and rainwater, thereby protecting internal components from moisture.
Furthermore, it also has an IP67 rating for protection, ensuring complete prevention of dust ingress and reliable operation in dusty environments. This makes our camera highly suitable for outdoor applications, whether it’s on construction sites or farms, enabling reliable operation in adverse natural conditions.
In recent years, eYs3D Microelectronics has also been involved in the development of products that comply with MIL-STD-810 specifications. We have collaborated with the aforementioned upcoming product for reference design and partnered with multiple outdoor mobile robot companies for product development. Our intelligent binocular vision camera offers exceptional functionality and performance. Through advanced intelligent technology, it can perform real-time image analysis and processing to achieve precise recognition of the environment and objects. These features are highly suitable for autonomous mobile systems such as transport robots and smart agricultural machines, providing accurate visual navigation and obstacle recognition, thereby enhancing operational safety and efficiency.
In addition to the aforementioned features, our intelligent binocular vision AI camera also boasts the advantage of easy installation and operation. It provides a simple and intuitive user interface, allowing users to effortlessly configure and control the camera’s functions. Additionally, the camera is compatible with multiple communication protocols and interfaces, enabling seamless integration with other systems. We believe that the intelligent binocular vision camera will bring tremendous value to outdoor and harsh environment applications. Whether it’s in transport robots, smart agricultural machines, or military and defense fields, this camera will provide excellent performance and reliability, thereby enhancing operational efficiency and safety.
If you are interested in experiencing the interaction and applications of 3D image sensing, we welcome you to visit eYs3D Microelectronics’ booth (Booth Number Q1212, 1st floor, Nangang Exhibition Center Hall 2) or Etron Booth (N0302, 4th Floor, Hall 1 of the Taipei Nangang Exhibition Cent) during the 2023 InnoVEX exhibition, held from May 30th to June 2nd in conjunction with Computex & InnoVEX.
About eYs3D Microelectronics
eYs3D Microelectronics Corp.is a pioneer in 3D sensing technologies, and aims to develop semiconductor oriented technologies and products related to 3D vision-simulating computer vision technologies integrated with computer intelligence. With its strong foundation and experience in memory design and computer vision, as well as close co-operation with its parent company, Etron Technology, Inc., and ARM Holdings Plc., eYs3D strives to develop new technologies to take advantage of computer vision chips and subsystems. It targets blue-ocean markets such as smart products, intelligence of things (IoT), and industrial and consumer level automation, to become a leading brand in the market of computer vision processing. For more information, visit www.eys3d.com
About Etron Technology, Inc.
Etron Technology, Inc. (TPEx: 5351.TW) is a world-class fabless and heterogeneous integration IC design company that specializes in application-driven buffer memory, known-good die memory (KGDM), long-retention time DRAM (RPC DRAM), and other artificial intelligence and machine learning induced DRAM products. Etron also develops system-in-packages, including high-speed transfer interface chips of USB Type-C, and 3D depth sensing computer vision and panoramic image capturing chips. www.etron.com
Etron Tech Ms. Justine Tsai Tel: +886-3-578-2345 #8670 Email: email@example.com
eYs3D Ms. Olivia Wu Tel: +886-2-8751-1691#2529 Email：Olivia.Wu@eys3d.com