A new generation of AI accelerators, with computing power surpassing peer products and programmable development capabilities, supports a wide range of AI models. In the fast-evolving AI landscape, this platform is designed to meet future computing demands. Following the [flagship] XINK Robotics Vision Platform, eYs3D Microelectronics and Etron Tech (TPEx: 5351.TW) jointly announce the [lightweight] edge AI real-time sensing and computing fusion XINK Nano Platform. It integrates multi-sensor fusion, real-time AI recognition, and edge computing architecture, equipped with 3D RGB imaging, ToF depth sensors, and corresponding algorithms. Combined with lightweight model computation and autonomous data generation training processes, it supports common AI models such as YOLOv8 and Pose Estimation. With high flexibility, modularity, and scalability, it can be widely applied to smart transportation, autonomous robots, drones, security monitoring, and smart environment sensing.
Currently, the XINK Nano platform has been successfully adopted by Taiwan’s leading EV charging brand in smart parking applications, demonstrating its outstanding advantages in real-time responsiveness and low-latency computing. XINK Nano is the preferred solution for local edge AI sensing and computing. We sincerely welcome system integrators to collaborate and co-create a smarter future together.
The XINK Nano edge AI real-time sensing and computing fusion platform is powered by the eCV4 series SoC, featuring dual-core ARM Cortex-A55 processors and a dedicated edge AI architecture. It supports mainstream models such as YOLOv8 and Pose Estimation. The platform integrates 3D RGB imaging, ToF depth sensors, and algorithms to precisely execute license plate recognition, parking space status detection, smart charging management, and anomaly detection. It offers advantages of low power consumption, low maintenance, and high real-time responsiveness.
At the technical core, eYs3D introduces an AI Hybrid Model architecture, combining lightweight model computation with autonomous data generation training. This reduces reliance on high-compute resources while improving training efficiency and deployment flexibility. AI models can thus be executed locally with both accuracy and data security, providing stable and reliable real-time sensing and decision support for smart environments.
Smart Parking Deployment: Realizing the Vision of Smart Cities
Partnering with Taiwan’s leading EV charging brand, eYs3D has deployed the XINK Nano edge AI platform to build smart parking lots that integrate AI detection, real-time monitoring, and smart charging management. This enhances traffic efficiency and green energy management, embodying the vision of “Smart Transportation × Green Energy Management” and delivering a more convenient parking and charging experience for drivers.
The core platform, XINK Nano, features a high-performance NPU (Neural Processing Unit) supporting RGB and ToF dual-sensor fusion computing. Unlike traditional cloud-dependent architectures, XINK Nano provides local real-time AI computing, reducing data transmission latency and network bandwidth reliance, while significantly lowering operational costs and improving system stability and responsiveness.
Key Smart Parking Functions
Thanks to its innovative and practical edge AI real-time sensing and computing fusion capabilities, XINK Nano won the Gold Medal at the 2025 Smart Innovation Grand Awards, highlighting its technological leadership in edge AI and smart sensing, as well as its strong international competitiveness.
The XINK Nano platform and its smart parking applications will be demonstrated live at CES 2026 at the Etron Technology Group booth. Under the theme “MemorAiLink show up,” Etron Technology will showcase innovations across four key domains: memory, intelligent vision sensing, high-speed transmission, and privacy-preserving computing. These solutions empower AI, enhance system performance, reduce design complexity, and accelerate the deployment of intelligent and automated applications—advancing the vision of a smarter future. We sincerely invite industry professionals to visit the Etron Technology Group booth during CES 2026 (January 6–9) at Booth No. 14841, Central Hall, LVCC, to explore, exchange ideas, and create win-win opportunities together.
Caption: eYs3D’s XINK Nano Edge AI Sensing Fusion Platform Wins the 2025 Smart Innovation Grand Award
About eYs3D Microelectronics
eYs3D Microelectronics Corp.is a pioneer in 3D sensing technologies, and aims to develop semiconductor oriented technologies and products related to 3D vision-simulating computer vision technologies integrated with computer intelligence. With its strong foundation and experience in memory design and computer vision, as well as close co-operation with its parent company, Etron Technology, Inc., and ARM Holdings Plc., eYs3D strives to develop new technologies to take advantage of computer vision chips and subsystems. It targets blue-ocean markets such as smart products, intelligence of things (IoT), and industrial and consumer level automation, to become a leading brand in the market of computer vision processing. For more information, visit www.eys3d.com
About Etron Technology, Inc.
Etron Technology, Inc. (TPEx: 5351.TW) is a world-class fabless and heterogeneous integration IC design company that specializes in application-driven buffer memory, known-good die memory (KGDM), long-retention time DRAM (RPC DRAM), and other artificial intelligence and machine learning induced DRAM products. Etron also develops system-in-packages, including high-speed transfer interface chips of USB Type-C, and 3D depth sensing computer vision and panoramic image capturing chips. www.etron.com
For further information, please contact:
Corporate Spokesperson:
Ms. Justine Tsai
Corporate Deputy Spokesperson:
Mr. Eason Cheng
Tel: +886-3-578-2345 #8670
Email: [email protected]