With the rapid growth of demand for machine vision and autonomous mobility, service and industrial robots are accelerating their entry into factories, shopping malls, and everyday life. Seizing this trend, eYs3D Microelectronics and Etron Technology (TPEx: 5351.TW) will jointly unveil at CES 2026 the latest Sense & React “Robotics Subsystem Platform – AMR01C / AMR01M.” By combining proprietary 3D sensing modules with XINK edge computing units, the platform delivers an end-to-end solution ‒ from sensing, computing, to control ‒ helping customers quickly build autonomous vehicles and service robots.
Sense: Giving Robots Their “Eyes”
On the sensing side, the platform adopts multiple eYs3D Stereo Depth Cameras, including the G120/G100 with wide field-of-view and long-range capabilities, as well as the compact, easily embedded G62. These modules support high-resolution depth imaging and RGB output, enabling simultaneous execution of SLAM, obstacle avoidance, object detection, and tracking. They provide robots with comprehensive environmental perception, suitable for indoor and outdoor navigation as well as precise docking applications.
React: XINK AMR Subsystems Empower Edge Autonomous Decisions
On the React side, the platform incorporates the XINK series AI computing mainboard YX5001 together with the YX4517 subsystem board, integrating Cortex-A55, Cortex-M4, and an NPU delivering up to 4 TOPS. This configuration enables real-time path planning, multi-sensor fusion, and AI inference directly at the edge. Based on this computing core, eYs3D has launched two new AMR subsystems: AMR01C and AMR01M, designed respectively for light-load (50Kg) and medium-load (100Kg) requirements, targeting mainstream applications in logistics, food service, and service robots.
Core Value: Integrated Design, Accelerated Time-to-Market
The core value of the AMR01C / AMR01M robotics subsystem platform lies in its integrated design, which accelerates time-to-market. It provides a fully unified solution covering chassis, drive, sensing, and control, with navigation and obstacle avoidance algorithms pre-integrated to eliminate the complexity of ground-up development. System integrators and brand customers can simply build upon this foundation by quickly adding customized upper structures ‒ such as shelves, food carts, containers, or robotic arms ‒ significantly shortening development and validation cycles and enabling their robot products to enter the market faster.
From Modules to Subsystems:
Accelerating Global High-Mix, Low-Volume Robot Deployment
The eYs3D Sense & React “Robotics Subsystem Platform – AMR01C / AMR01M” integrates 3D sensing modules, edge computing boards, and motion control software into reusable, modular building blocks. This design not only supports local customers in Taiwan but is also tailored for international markets with high-mix, low-volume requirements. Customers can directly procure the platform and carry out local post-processing and customization of appearance, vehicles, and application modules, enabling them to quickly launch robot products aligned with their brand positioning and specific use cases. The platform also reserves interfaces for cloud and backend integration, facilitating fleet management, remote monitoring, and data analytics.
eYs3D will further collaborate with cloud and AI ecosystem partners to introduce a Hybrid AI (cloud-edge collaborative) architecture. At the Edge: Provides robots with real-time responsiveness, ensuring fast decision-making and reliable local operation. In the Cloud: Harnesses powerful cloud computing for model training, updates, and intelligent operational management. Through this cloud-edge deployment model, the vision of Physical AI is realized ‒ bringing AI beyond the virtual world to efficiently and intelligently serve the physical environment.
Etron Technology Group will present at CES 2026 under the central theme “MemorAiLink show up.” The showcase will focus on four key domains: memory, intelligent vision sensing, high-speed transmission, and privacy-preserving computing. The company will comprehensively demonstrate innovative technologies and edge AI solutions that empower AI, enhance system performance, reduce design complexity, and accelerate the deployment of intelligent and automated applications—advancing the vision of a smarter future. We sincerely invite industry professionals to visit the Etron Technology Group booth during CES 2026 (January 6–9) at Booth No. 14841, Central Hall, LVCC, to explore, exchange ideas, and create win-win opportunities together.
About eYs3D Microelectronics
eYs3D Microelectronics Corp.is a pioneer in 3D sensing technologies, and aims to develop semiconductor oriented technologies and products related to 3D vision-simulating computer vision technologies integrated with computer intelligence. With its strong foundation and experience in memory design and computer vision, as well as close co-operation with its parent company, Etron Technology, Inc., and ARM Holdings Plc., eYs3D strives to develop new technologies to take advantage of computer vision chips and subsystems. It targets blue-ocean markets such as smart products, intelligence of things (IoT), and industrial and consumer level automation, to become a leading brand in the market of computer vision processing. For more information, visit www.eys3d.com
About Etron Technology, Inc.
Etron Technology, Inc. (TPEx: 5351.TW) is a world-class fabless and heterogeneous integration IC design company that specializes in application-driven buffer memory, known-good die memory (KGDM), long-retention time DRAM (RPC DRAM), and other artificial intelligence and machine learning induced DRAM products. Etron also develops system-in-packages, including high-speed transfer interface chips of USB Type-C, and 3D depth sensing computer vision and panoramic image capturing chips. www.etron.com
For further information, please contact:
Corporate Spokesperson:
Ms. Justine Tsai
Corporate Deputy Spokesperson:
Mr. Eason Cheng
Tel: +886-3-578-2345 #8670
Email: [email protected]