Home » Press Room » Product News » [CES 2025] eYs3D Microelectronics Showcases the latest Unmanned Vehicle Navigation YX9670 Solution, Paving The Way for Next-Generation AI Human-Machine Interaction Interfaces
Source: YX9670 Navigation Solution for Unmanned Vehicles by eYs3D
The AI trend has significantly increased the demand for computer vision in electronic products. According to market research reports, the global autonomous navigation ship market is projected to reach a value of $4.9 billion by 2030. Recognizing this market opportunity, Etron Technology (TPEx: 5351.TW) subsidiary eYs3D Microelectronics has launched its latest unmanned vehicle navigation solution, the YX9670. Leveraging advanced multi-sensor fusion and AI-driven technology, this solution revolutionizes environmental perception and navigation capabilities. It features the eSP936 chip from the eYs3D Multi-Sensor Processor series and the eCV5546 chip from the Fusion Compute series, demonstrating exceptional breakthroughs in sensing technology and intelligent integration.
The core advantage of this solution lies in its comprehensive sensor fusion capabilities. It integrates a dual-depth sensor system supporting high-definition images up to 1280×720 resolution, accompanied by four RGB cameras working in sync to deliver a wide 278-degree panoramic view. Additionally, a monochrome camera provides a 145-degree overhead perspective. The system includes an embedded high-efficiency Attitude and Heading Reference System (AHRS) module for vessel and posture recognition and successfully incorporates a thermal imaging sensor, creating an exceptionally advanced perception system.
The intelligent perception system is another major highlight of this solution. Embedded AI algorithms enable real-time object recognition within the panoramic view, navigation direction analysis, and multi-target tracking. Even in complex or adverse environments, the system maintains high efficiency in detection and identification, showcasing its exceptional technical capabilities.
The built-in eSP936 sensor control chip innovatively maximizes the potential of Sensor Fusion technology, enabling the integration of data from multiple sensors into a unified view and supporting the synchronization of 2D and 3D sensor data. Its built-in Motion JPEG engine not only enhances data compression and transmission efficiency but also optimizes the spatial and temporal alignment of multi-source data, significantly improving overall system performance.
The built-in eCV5546 sensor fusion processing chip features ARM Cortex-A and Cortex-M CPU cores along with an NPU (Neural Processing Unit). It supports the fusion of AHRS, thermal imaging, and millimeter-wave radar sensors, while integrating AI convolutional neural network (CNN) technology. This significantly enhances the object recognition and detection capabilities of edge devices.
The YX9670 solution has been successfully applied in unmanned vessel navigation, providing safe and efficient navigation support for logistics ships, environmental monitoring vessels, and specialized unmanned ships. With its advanced sensing technology and AI computing capabilities, the solution not only meets current needs but also opens up new development opportunities for future intelligent navigation human-machine interaction interfaces.
CES is a globally influential technology event, and Etron Technology Group focuses on the theme of “Innovation in Action, AI Implementation, and Connecting MemorAiLink to Shape the Future.” Etron Technology Group demonstrates its commitment to developing innovative products with IC solutions that embody “Pervasive Intelligence” and “Heterogeneous Integration.” These products empower electronic devices with AI capabilities such as cognition, vision, neural networks, and privacy, enriching AI applications while advancing the vision of future living. Etron Technology Group’s booth (Booth Number: 15741, Central Hall, LVCC) is open for visits and collaboration, aiming for a win-win partnership!www.etron.com
About eYs3D Microelectronics
eYs3D Microelectronics Corp.is a pioneer in 3D sensing technologies, and aims to develop semiconductor oriented technologies and products related to 3D vision-simulating computer vision technologies integrated with computer intelligence. With its strong foundation and experience in memory design and computer vision, as well as close co-operation with its parent company, Etron Technology, Inc., and ARM Holdings Plc., eYs3D strives to develop new technologies to take advantage of computer vision chips and subsystems. It targets blue-ocean markets such as smart products, intelligence of things (IoT), and industrial and consumer level automation, to become a leading brand in the market of computer vision processing. For more information, visit www.eys3d.com
About Etron Technology, Inc.
Etron Technology, Inc. (TPEx: 5351.TW) is a world-class fabless and heterogeneous integration IC design company that specializes in application-driven buffer memory, known-good die memory (KGDM), long-retention time DRAM (RPC DRAM), and other artificial intelligence and machine learning induced DRAM products. Etron also develops system-in-packages, including high-speed transfer interface chips of USB Type-C, and 3D depth sensing computer vision and panoramic image capturing chips. www.etron.com
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