Home » Press Room » Product News » [CES 2025] eYs3D Launches eSP936 Multi-Sensor Image Controller IC Accelerating the Deployment of Smart Unmanned Vehicles and Robotics Applications
With the rapid rise of AI image sensing and edge computing technologies, the robotics and smart unmanned vehicle market is experiencing explosive growth. eYs3D Microelectronics (eYs3D), a subsidiary of Etron Technology (TPEx: 5351.TW), officially announces the launch of the new eSP936 multi-sensor image controller IC. eSP936 supports synchronized processing of data from up to seven visual sensors, providing high image recognition accuracy. Paired with its Sense and ReactTM human-machine interaction developer interface, it enables intelligent control through human-machine interaction, becoming a key engine driving the deployment of smart applications.
The eSP936 chip is designed for high-performance requirements and is compatible with VLM (multimodal visual language model) applications. It integrates multiple visual sensors and real-time AI edge computing capabilities to enable multi-processing of image data and intelligent responses. It is suitable for:
Key technology highlights of the eSP936 include: support for synchronized processing of data from up to seven visual sensors, built-in DRAM chip, and wide-angle image de-warping technology, enabling high-precision environmental perception and multi-view 3D depth map generation. It also features high-performance data compression capabilities to reduce latency, providing developers with a flexible and efficient platform. The MIPI+USB simultaneous processing technology ensures high-quality 2D image and 3D depth map output, improving image recognition accuracy.
According to market forecasts, the global robotics market is expected to grow rapidly in the coming years, with particularly strong demand for service robots and unmanned vehicles. The eYs3D Microelectronics eSP936 chip platform not only overcomes technical limitations but also accelerates the widespread adoption of smart applications, injecting new momentum into the global robotics and AI markets.
CES is a globally influential technology event, and Etron Technology Group focuses on the theme of “Innovation in Action, AI Implementation, and Connecting MemorAiLink to Shape the Future.” Etron Technology Group demonstrates its commitment to developing innovative products with IC solutions that embody “Pervasive Intelligence” and “Heterogeneous Integration.” These products empower electronic devices with AI capabilities such as cognition, vision, neural networks, and privacy, enriching AI applications while advancing the vision of future living. Etron Technology Group’s booth (Booth Number: 15741, Central Hall, LVCC) is open for visits and collaboration, aiming for a win-win partnership!
About eYs3D Microelectronics
eYs3D Microelectronics Corp.is a pioneer in 3D sensing technologies, and aims to develop semiconductor oriented technologies and products related to 3D vision-simulating computer vision technologies integrated with computer intelligence. With its strong foundation and experience in memory design and computer vision, as well as close co-operation with its parent company, Etron Technology, Inc., and ARM Holdings Plc., eYs3D strives to develop new technologies to take advantage of computer vision chips and subsystems. It targets blue-ocean markets such as smart products, intelligence of things (IoT), and industrial and consumer level automation, to become a leading brand in the market of computer vision processing. For more information, visit www.eys3d.com
About Etron Technology, Inc.
Etron Technology, Inc. (TPEx: 5351.TW) is a world-class fabless and heterogeneous integration IC design company that specializes in application-driven buffer memory, known-good die memory (KGDM), long-retention time DRAM (RPC DRAM), and other artificial intelligence and machine learning induced DRAM products. Etron also develops system-in-packages, including high-speed transfer interface chips of USB Type-C, and 3D depth sensing computer vision and panoramic image capturing chips. www.etron.com
For further information, please contact:
Corporate Spokesperson:
Ms. Justine Tsai
Corporate Deputy Spokesperson:
Mr. Eason Cheng
Tel: +886-3-578-2345 #8670
Email: [email protected]