Etron Technology, Inc. (TPEx: 5351) has been awarded the 2025 Science Park Innovative Product Award for its industry-leading “RPC® inside G120 Subsystem,” underscoring the company’s outstanding innovation and technical expertise in AI vision and semiconductor integration. Designed specifically for next-generation robotic vision applications, the RPC® inside G120 Subsystem integrates dual RGB color image sensors, Etron’s proprietary RPC DRAM® memory, and the eSP906U image processing chip within a heterogeneous integration architecture. This approach effectively optimizes overall SoC performance and cost, making it one of the world’s smallest imaging-based machine learning and AI subsystems.
The award-winning subsystem is further enabled by Etron Technology’s newly introduced MemorAiLink® High-Efficiency AI Memory Platform. MemorAiLink® focuses on the integration of memory and logic design, offering a one-stop development service that combines embedded memory and memory controllers to support logic chips. This platform injects new momentum into Edge AI innovation by maximizing memory bandwidth efficiency, reducing overall subsystem power consumption, and optimizing heterogeneous integration and advanced packaging technologies. As such, it has become a key development partner for ASIC and neural network-based systems.
At the core of the solution, RPC DRAM® supports the world’s first miniature FI-WLCSP (Fan-In Wafer-Level Chip Scale Package) technology, measuring only 1.96 mm × 4.63 mm. It delivers x16 DDR3 bandwidth with reduced power consumption and has successfully passed AEC-Q100 Level 2 automotive-grade qualification, demonstrating high reliability and strong potential for industrial and automotive applications. The package supports a 50-ball design while requiring only 22 switching signals, significantly simplifying system design.
In terms of system performance, the G120 Subsystem supports synchronized data acquisition from 2D and 3D sensors, enabling simultaneous output of high-quality 2D images and highly accurate 3D depth images. It features a Motion JPEG engine, depth image processing, and multi-camera synchronization capabilities, supporting image output of up to 60 frames per second (60 fps). With a 120° horizontal and 75° vertical field of view, the system meets the demanding requirements of high-precision depth sensing applications.
The product demonstrates strong market potential across AI vision, robotics, and Edge AI devices. Etron Technology has also completed comprehensive patent deployments across major markets, including the United States, Japan, Korea, and China, ensuring technological maturity and robust intellectual property protection. These achievements lay a solid foundation for the company’s continued advancement in AI imaging and memory integration technologies.
Building on this award-winning innovation, the Etron Technology Group will participate in CES 2026, the world’s most influential consumer electronics exhibition, under the theme “MemorAiLink® Show Up.” The group will showcase a range of cutting-edge Edge AI solutions, highlighting its ongoing commitment to innovative product development and its vision for the future of smart living.
We cordially invite our industry partners and visitors to join us at the Etron Technology Group booth (Booth No. 14841, Central Hall, LVCC). Let’s connect, collaborate, and create mutual success together.
Caption: Etron Technology’s “RPC® inside G120 Subsystem” wins the 2025 Science Park Innovative Product Award.
About Etron Technology, Inc
Etron Technology, Inc. (TPEx: 5351. TW) is a world-class fabless and heterogeneous integration IC design company that specializes in the application-driven buffer memory, known-good die memory (KGDM), innovative RPC DRAM® and other artificial intelligence and machine learning-induced DRAM products. It also features high-speed transfer interface chips for USB Type-C, Machine Vision Sensing Cameras, Modules, and ICs, along with a Depthmap Processing Unit. These offerings can be integrated to fulfill customer requirements for AI applications. To learn more, please visit www.etron.com
For further information, please contact:
Corporate Spokesperson:
Ms. Justine Tsai
Corporate Deputy Spokesperson:
Mr. Eason Cheng
Tel: +886-3-578-2345 #8670
Email: [email protected]