Join us at #CES2026 to experience groundbreaking solutions that empower electronic products with advanced AI capabilities. Etron, a leader in innovation, brings IC products to life by emulating the functions of the brain, eyes, and nervous system – all while ensuring top-tier privacy. Committed to enhancing quality of life, we invite you to explore our vision for a redefined future.
CES Innovation Award 2026/2024/2023
DeCloak Intelligence – an Etron Company – has been honored with the CES Innovation Award in 2024, 2025, and now again in 2026. This year, the company will continue to showcase its cutting-edge, privacy-preserving facial recognition and surveillance solutions powered by multimodal AI models. Don’t miss out!
Highlight in CES 2026
MemorAiLink® is an AI memory platform that integrates software and hardware architectures, combining homogeneous and heterogeneous systems, specialized DRAM, memory control IP, and packaging technologies. It offers solutions for memory and packaging integration, providing innovative memory products, optimized heterogeneous packaging, and memory interface IP services for AI SoCs.
This platform enhances SoC performance, reduces costs, and meets capacity and bandwidth needs. MemorAiLink®’s one-stop IP service ensures smooth communication between SoCs and memory, reducing complexity, shortening time-to-market, and giving customers a competitive advantage in AI development.
At 2026 CES, Etron will showcase the RPC® inside G120 subsystem, which recently won the Taiwan Hsinchu Science Park 2025 Innovative Product Award. This solution incorporates Etron’s innovative RPC DRAM®, which delivers x16 DDR3 data bandwidth in a compact Known-Good-Die or FI-WLCSP package. Compared to standard DDR3, this approach simplifies wire bonding and packaging design, helping to reduce overall system costs. By integrating the RPC DRAM and Controller with 3D depth-sensing chips from our subsidiary, eYs3D, the subsystem offers an effective AI edge platform for miniaturized, low-power, and specific ASIC applications.
Etron’s complete memory solutions can fully satisfy customer needs ranging from Wi-Fi 5, Wi-Fi 6/6E, Wi-Fi 7, and beyond. Additionally, Etron’s deep strategic alliances with supply chain partners enable us to provide customers with a long-term and reliable supply of DDR4 & LPDDR4/4X products.
As the semiconductor market evolves, Etron Technology remains focused on customer requirements. Through our commitment to innovation and robust Longevity Support programs, we consistently refine our technology and services, positioning ourselves as your trusted memory partner dedicated to meeting long-term industry demands.
At CES 2026, eYs3D presents a new vision of Physical AI – AI that does not stay on screens, but lives inside machines, moves through the world, and makes decisions at the chip level.
Building on years of experience in stereo vision and 3D sensing, we now offer a modular Physical AI platform for machines. Our G100+, G62 and R77 stereo cameras deliver SLAM, obstacle avoidance, detection and tracking capabilities for robots, drones, and smart infrastructure. These sensors feed into our XINK NANO Edge AI and XINK AI Controller platforms, combining Cortex-A55 and Cortex-M4 processors with a 4 TOPS NPU to provide local autonomy with low power and small form factor.
On top of sensing and silicon, we introduce Sense & React AMR barebones, drone and smart-parking solutions that turn our chips and cameras into ready-to-deploy building blocks for real applications: mobile robots, logistics automation, retail analytics, and more.
To extend intelligence beyond the device, eYs3D embraces Hybrid AI – edge inference tightly integrated with cloud-native services. Models can be trained and managed in the cloud, then deployed, updated, and orchestrated across fleets of devices, enabling robot intelligence, distributed compute, model deployment, and device management at scale.
As a silicon-centric, Physical AI company, eYs3D is enabling a new generation of autonomous machines that can sense, understand, and react to the physical world – bringing AI in motion to factories, cities, and everyday life.
DeCloak Intelligences Co. will showcase its latest privacy-enhanced AI innovations at CES 2026, led by its award-winning DeCloakBrain™ Privacy-Intelligent AI Robotic Decision System, recognized as a CES 2026 Innovation Awards Honoree.
DeCloakBrain™ is built on DeCloak’s proprietary Privacy-Intelligent Computing architecture, performing real-time, irreversible de-identification at the perception layer while enabling Super-Visual Synthesis, Multimodal Spatial Reasoning, and Robot-to-Robot Collaborative Intelligence. Whether deployed in healthcare, industrial, or public environments, DeCloakBrain™ delivers global perception, autonomous decision-making, and coordinated mission execution—all without exposing any identifiable personal data. The system fully complies with the EU AI Act, HIPAA, and other stringent global regulations.
With DeCloakBrain™ at the core, DeCloak has developed a comprehensive Privacy-Intelligent Autonomous Ecosystem, integrating perception, identity, and decision intelligence into a unified framework:
DeCloakVision™ serves as the privacy-preserving perception layer, performing instant de-identification at the moment of capture while retaining essential features such as posture, behavior, and trajectories. It powers fall detection, safety analytics, behavior understanding, and smart inspection across hospitals, factories, and sensitive environments.
DeCloakFace™ provides the ecosystem’s privacy-enhanced identity layer, enabling high-trust authentication through an obfuscated deep-learning model that verifies identity without exposing original facial imagery.
Together, the three technologies operate through differential privacy, federated learning, and privacy-secure channels, forming a cross-domain autonomous network that supports safe, compliant AI deployment in medical facilities, industrial sites, smart cities, and multi-robot systems.
With three consecutive CES Innovation Awards—DeCloakFace™, DeCloakVision™, and DeCloakBrain™—DeCloak continues to lead the global movement toward privacy-first AI.
The eEver EJ732 family USB Power Delivery (PD) Controller has officially received USB-IF PD3.2 certification as of October 9, 2024 (TID: 11771). With this certification, the EJ732 family aligns with the USB Power Delivery 3.2 (PD3.2) standard, supporting efficient power negotiation through a single USB Type-C connection, making it ideal for modern, high-power devices.
Covering host, device, and cable control, EJ732 stands as the industry’s most comprehensive PD 3.2 platform, enabling seamless cross-device interaction. This one-stop solution empowers brands to simplify sourcing, reduce design complexity, and launch products to market faster than ever. Make a reservation with us today to see our privacy-centric solutions at CES 2026!
CES Expo Information
