FOR IMMEDIATE RELEASE[NEWS RELEASE]Etron Technology and eYs3D Microelectronics ShowcaseTrueVision Depth Imaging PlatformGiving Machine Vision It’s Human Like 3D SensesThe sources of perceptual signals that artificial intelligence currently need is divided into: 1. speech 2. Image. The application of speech mainly focuses on “sound recognition” and “voice control”. For Image, development is currently focused on “face recognition” and “distance measurement” where as speech technology is more applied within the field of smart speakers. Compared to the artificial intelligence of speech, the application of visual artificial intelligence can be widely used in different domains such as, advanced driving Assistive system (ADAS), head mount display (HMD), Robot Vacuum Cleaner, Face Recognition Access Control, etc.; It is categorized into two categories: Planar 2D sensing / 3D sensing, in the past mechanical vision is limited by the sensing components and computing power limitations, most of the applications are constructed in 2D image sensing technology. In many occasions 2D Image recognition is an unreliable for not being able to provide spatial information of the target. For example, face recognition systems deceived by 2D plane photos/videos, which is why China will now standardize face recognition systems to assist with 3D imaging technology or other Anti-counterfeiting technology to ensure its reliability and safety. For the longest time the world hoped that ,machine vision can be seen as human’s actual view as well as images with 3d depth information. Following advancement of technologies and the Increasing market demand, eYs3D is committed to the field of 3D sensing. Developed a binocular depth vision (Stereoscope) to visualize images with color and depth information, so machine vision can now be both 2D and 3D!eYs3D’s TrueVision platform, which publishes more user-friendly 3D software, not only it intelligently support the company’s unique 180/360 degree 1080p/720p depth map camera, but also display color bionic 3D points statically or instantly. Color Dynamic Point Cloud, up to 6Mp for high-accuracy scanning/modeling, support for multi-group 3D depth map camera synchronization and 6-DoF IMU data capture and synchronization, it is the best tool for customers to evaluate and develop depth map cameras. TrueVision uses high-precision image sensing components with up to 6Mb resolution and the Depth Engine to seamlessly combine color images with deep point cloud images, enables machine vision’s edge computing Capability. Significantly drop the computing power of back-end system. The TrueVision “Vision” platform is developed based on innovative perspectives, allowing 180/360 degree color depth vision to make your system sees wider. Supporting Multiple Base Line allows your system to see farther and farthest up to 15 meters. In addition, the TrueVision platform can simultaneously synchronize multiple 3D depth vision modules. This feature allows visual positioning and construction (vi-SLAM) to construct sophisticated 3D objects and maps more efficiently.TrueVision also has a Dynamic Point Cloud display feature that allows 3D interactive gaming systems to easily achieve Skeleton Detection, effectively reducing the CPU and GPU computing power. In addition to that the ability to impose the 3D image to the screen, players can experience a more realistic 3D interactive experience. We sincerely invite you to visit the booth at the CES exhibition from May 28th to June 1st, 2019: Taipei Nangang Exhibition Hall 2, booth No. S0410.About eYs3D Microelectronics, Corp.eYs3D Microelectronics, Corporation is a world leading provider of the 3D depth-sensing solutions provider focusing on innovative natural light 3D depthmap and 360o spherical camera processors & systems. www.eys3d.comAbout Etron TechnologyEtron Technology, Incorporated (TPEx: 5351.TW) is a world-class fabless IC and Heterogeneous Integration (HI) Silicon design house with products ranging from Consumer Electronics DRAM (CEDRAM), Known-Good-Die Memory (KGDM), RPCTM (Reduced-Pin-Count) DRAM; USB3.1 Gen2 Type-C high speed switch/mux controller with Power Delivery; and 3D Depthmap and Stereoscopic Vision Sensing & Spherical Image-Processing ICs and Subsystems. www.etron.comFor further information, please contact:Corporate Spokesperson:Ms. Justine Tsai Corporate Deputy Spokesperson:Mr. Eason ChengTel: +886-3-578-2345 #8670Email: pr@etron.com.tw